Ceramic Resistor Heat Sink. In the case of Figure 5 when the ambient temperature is 50°C the maximum permissible power P = (155°C 50°C) / 36 = 29 W Notice that if a resistor flange is mounted on a heat sink which is maintained at 25°C say by forced air or liquid cooling the maximum power which can be applied is also the rated power of the device = (155°C – 25°C) / 13 = 100 W Author Riedon Inc.
Heatsink (incl TO220 SOT227) Resistors Fixed manufactured by Vishay a global leader for semiconductors and passive electronic components.
C Series Heatsink Ohmite Mfg Co
Yes you are right but I can't use an aluminium heatsink since it would have to be in contact with the resistive wire and both of the materials are conductors which could be dangerous if some part of the circuit was to come in contact with the heatsink @Diesel Clay Thanks for the clarification!.
Heat Sinkable Resistors Ohmite Mfg Co
Much smaller than standard parts of the same wattage Heatsinkable resistors release their heat in one plane The single side is attached to a heatsink and the heat generated is absorbed Once the heat is absorbed it is released into the air through the heatsink.
High Voltage ThickFilm Ceramic Heatsink TRH Series
The Ohmite TRH combines two products in one Ohmite uses advanced thickfilm printing processes to place a resistor onto a ceramic heatsink The TRH Series replaces common thickfilm heatsinkable products and the heatsink and hardware associated with them The resistor and heatsink are one unit and work together with great thermal efficiency.
Making Work Studio Operations and Ceramic Resistor
Heat Transfer in Power Resistors Use of Heat Sinks DigiKey
TO220/TO126 Heat Sinks Designed for TO126 TO220 TO247 and TO264 devices This extruded heatsink offers multiple lengths and sizes Each extrusion utilizes the patented clipping system This system requires on tools and can lock in the device with on finger The cam locking system engages the device securely for a proper thermal connection The C series from Ohmite is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced.